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| Board Design & Development |
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| ProcSys team has a rich experience in designing high-speed, high-density multi-layer boards and systems, coupled with a proven design practice that helps us deliver complex boards on time. |
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ProcSys offers complete board
design capability - from requirements to design, layout,
prototyping, testing and transfer to production. Our
team has rich experience in designing high-speed,
high-density multi-layer boards and systems. This
coupled with proven design processes & methodologies
help us meet the challenge of delivering complex boards
on time to meet the reduced time-to-market requirements
of our customers. |
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| Solutions |
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| Embedded Single Board Computers , Host Controller Cards & Motherboard based on: |
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Embedded Intel Architecture ( x86 ) – Celeron M, Pentium M, Core Duo and |
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Core 2 Duo |
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PowerPC with integrated peripherals - IBM4xx & MPC82xx |
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ARM 9 SoCs – OMAP, Atmel , PXA |
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MIPS SoC |
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Storm-1 Stream / parallel processing SoC |
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| Host controllers & line cards for chassis slot based systems |
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Host controllers: Embedded IA ( x86 ) Celeron M / Pentium M /Core 2 Duo & |
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PowerPC with integrated peripherals |
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LAN: 10/ 100/1000 and multi-gigabit Ethernet |
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Storage & SAN: Fibre Channel , SATA |
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Broadband Access: xDSL
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Metro/WAN: SONET/SDH, WDM, ATM,
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Switching & Routing: Switch fabrics, network processing, protocol accelerators, |
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packet inspection |
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Media Processing: DSP |
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Audio / Video processor cards : Capture, process, store, stream, playback |
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Microcontroller based boards and Industrial controllers |
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Peripheral adapters: PCI-Express, PCI, PCI-X, USB, PCMCIA and Compact FLASH |
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Silicon validation and reference boards |
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| Expertise |
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Architecture design |
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Schematics capture |
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Board layout |
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DFM/DFT |
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Signal integrity & Cross talk analysis |
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EMI/EMC analysis |
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Thermal analysis |
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Prototyping |
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Bring-up testing & Design validation |
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Pilot production (low volume) |
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Transfer to production |
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| ProcSys Advantage |
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Experience in medium to high complexity systems design |
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Domain expertise in datacom, telecom, aerospace/industrial and consumer |
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electronics |
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Well established and proven design & review processes |
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Experience in working with major manufacturing houses to meet DFM/DFT |
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requirements |
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Experience in working with accredited labs for environmental (EMC/ESD, vibration, |
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drop, safety etc.) compliance certification testing |
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Experience in cost reduction and reengineering |
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In-house electrical CAD team & tools |
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In-house mechanical design & product styling team |
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Specialized team for handling components & materials procurement |
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Pilot production for alpha and beta testing and early customer deployments |
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Complete design package for design transfer to volume production |
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Complementary design services: FPGA, firmware, products development, |
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Management and configuration application software. |
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Long term support contract for product maintenance and enhancements |
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| Capability Matrix |
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| Click here to send us an enquiry on any service or information you need and we will get in touch with you immediately. |
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